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Canadian application, no grantCanada

Permeation layer attachment chemistry and method

CA 2394934 A1 · Owner: Onofrey, Thomas J. · Inventors: Winger, Theodore M.; Smolko, Dan; Havens, John R.

CIPO record

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Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

Electronically addressable microchips having covalently bound permeation layers and methods of making such covalently bonded permeation layers to microchips are provided. The covalent bonding is derived from combining the use of electrodes with silane derivatives. Such chemistry provides the ability to apply an electronic bias to the electrodes of the microchip while preventing permeation layer delaminating from the electrode surface.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed October 31, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended October 31, 2020.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 31, 2022.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledOctober 31, 2000
GrantedNo grant recorded
Term endedOctober 31, 2020
Patent numberCA 2394934 A1
Classification (IPC)B01J19/00 +2 more

Timeline

Timeline From CIPO dates

2001200320052007200920112013201520172019Application filedOct 31, 2000Term endedOct 31, 2020

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.