Forming interconnects
CA 2394895 C · Owner: Plastic Logic Limited · Inventors: Sirringhaus, Henning; Kawase, Takeo; Friend, Richard Henry
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for forming an electronic device comprising: forming a first , conductive or semiconductive layer; forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layers; and depositing conductive or semiconductive material in the void.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 21, 2000 and granted January 28, 2014. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended December 21, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 21, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.