Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby
CA 2394458 A1 · Owner: Shellcase Ltd. · Inventors: Badehi, Avner Pierre
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
This invention discloses a crystalline substrate based device including a crystalline substrate (102) having formed thereon a microstructure (100); and at least one packaging layer (106) which is sealed over the microstructure by means of an adhesive and defines therewith at least one gap between the crystalline substrate (102) and the at least one packaging layer (106). A method of producing a crystalline substrate based device is also disclosed.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 26, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 26, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 26, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.