Integrated convection and conduction heat sink for multiple mounting positions
CA 2394064 A1 · Owner: Parkinson, Jay Berkley · Inventors: Tehan, Matthew A.; Parkinson, Jay Berkley; Losinski, Armand
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An integrated thermal management system for electronic devices includes a printed wiring board (13) for supporting electronic devices at least one die-, up (41-49) and one die-down electronic device (51 53), a frame (15) and a , heat sink (17). The board (13) includes at least one thermally conductive layer (25, 31), to which the die-down device (51 53) is thermally connected. , The frame member (15) which includes at least a first heat sink mounting location, is connected to one of the first (63) and second surfaces (65) of the board (13), adjacent to the edge. The heat sink (17) itself which is , cantilevered over the die-up electronic device (41-49) from at least one heat sink …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 11, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 11, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 11, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.