Pb-free solder alloy compositions comprising essentially sn, ag, cu, and/or p
CA 2389446 A1 · Owner: Leung, David Wai-Yin · Inventors: Leung, David Wai-Yin
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A Pb-free solder alloy is designed from the Sn based substrate which is a non-, toxic and, environmental friendly metal. The Pb-free solder includes a binary composition consisting, essentially of about 96.5 weight % Sn and 3.5 weight % Ag having an eutectic , temperature of 221 degree Celsius. In addition, a Pb-free solder includes a ternary composition consisting essentially of, about 95.5 to 96.5 weight % Sn 3.0 to 3.5 weight % Ag, and 0.5 to 0.7 weight % Cu, having, off eutectic melting temperatures of about 215-220 degree Celsius. The said solder compositions, can be modified with addition of 0.1 to 1.0 weight % P to enhance better , micro-structural stability and to reduce dross …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 10, 2002. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 10, 2022.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 10, 2024.
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Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.