Methods and apparatus for the electronic, homogeneous assembly and fabrication of devices

Abstract From the Canadian patent

Methods and apparatus are provided for the fabrication of microscale, including micron and sub-micron scale including nanoscale, devices. , Electronic transport of movable component devices is utilized through a fluidic , medium to effect transport to a desired target location on a substrate or motherboard. Forces include electrophoretic force electroosmotic force, electrostatic force and/or dielectrophoretic force. In the preferred embodiment, free field electroosmotic forces are utilized either alone or in conjunction , with, other forces. These forces may be used singly or in combination as well as in , conjunction with yet other forces such as fluidic forces, mechanical forces or , …