Electronic device with heat generating parts and heat absorbing parts
CA 2384164 A1 · Owner: Ootori, Yasuhiro · Inventors: Ootori, Yasuhiro
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
It is an object of the present invention to provide an electronic device which realizes efficient cooling of heat-generation components and which can be downsized. According to the electronic device of the present invention a , rectangular-shaped heat sink that absorbs heat of the CPU and is placed in a cooling air intake channel (71) upstream of the power source unit. By blowing low-temperature cooling air that does not contain heat radiating from the power source unit onto the rectangular heat sink the rectangular heat sink is , cooled, and CPU heat dissipation is promoted. In this way the CPU can be , efficiently cooled so that the electronic device can be made smaller than …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 1, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 1, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 1, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.