High density substrate and methods for manufacturing same
CA 2374863 A1 · Owner: Gotro, Jeffrey T. · Inventors: Androff, Nancy M. W.; Gotro, Jeffrey T.; Smith, Gordon
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
This invention concerns ultra-thin metal layer containing substrates useful for manufacturing high density circuits as well as novel methods for using the substrates to manufacture laminates, circuits interposers, and other , electronic laminates.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 14, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 14, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 14, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.