Robust interconnect structure
CA 2368950 C · Owner: Invensas Corporation · Inventors: Nye, Henry A. Iii; Mcgahay, Vincent; Ottey, Brian G. R.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A structure comprising a layer of copper (1) a barrier layer (10), a layer of , AlCu (9) and a pad-limiting layer (7), wherein the layer of AlCu and barrier layer are interposed between the layer of copper and pad-limiting layer.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 15, 2000 and granted October 2, 2012. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended May 15, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 15, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.