A control method for copper density in a solder dipping bath
CA 2368384 C · Owner: Koshi, Masuo · Inventors: Nishimura, Tetsuro; Todoroki, Kenichirou; Koshi, Masuo
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
This method controls a copper density in a dip solder bath holding a molten solder alloy containing at least copper as an essential composition thereof during a dip soldering step of one of a printed circuit board with a surfaced copper foil and a component part having a copper lead attached thereto. The method includes a step of introducing a replenished solder containing no copper at all or a copper content having a density lower than that of the molten solder in the bath prior to the supply of the replenished solder to the bath so that the copper density in the bath is controlled to a predetermined constant density or lower. The molten solder alloy in the bath contains tin …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 23, 2001 and granted April 5, 2011. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 23, 2021.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 23, 2023.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.