Electron beam process during damascene processing
CA 2368265 A1 · Owner: Alliedsignal Laminate Systems Inc. · Inventors: Ross, Matthew
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A process for the, formation of structures in microelectronic devices such as, integrated circuit devices. Vias interconnect metallization and, wiring lines are formed using single and dual damascene, techniques wherein dielectric layers are treated with a wide, electron beam exposure.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 16, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 16, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 16, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.