Apparatus and method for an integrated circuit having high q reactive components
CA 2362159 A1 · Owner: Baumann, Dan C. · Inventors: Baumann, Dan C.; Zavrel, Robert J. Jr.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In an IC packaging scheme, a multilayer substrate (114) is composed of electrically conductive layers of interconnects (120 122, 124), separated by , insulative layers of epoxy resin or ceramic and connected by vias. Passive elements (102, 104, 106) are integrated within the substrate (114) at the definition stage during layout of the interconnects (120 122, 124). The , passives (102, 104, 106) can be used to enhance the electrical performance of the active circuit die to a maximum extent allowed by the material technology used for the substrate. Material selection for the package is made to allow for the best passive integration for a given circuit design. Typical applications …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 2, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 2, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 2, 2021.
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Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.