Laminate for multi-layer printed circuit
CA 2360323 A1 · Owner: Ga-Tek Inc. (Dba Gould Electronics Inc.) · Inventors: Bergstresser, Tad; Poutasse, Charles A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A laminate for use as a surface laminate in a multi-layer printed circuit board. The laminate is comprised of a film substrate (12) formed of a first polymeric material. At least one layer of a flash material (14) is applied to a first side of the film substrate. At least one layer of copper (16) is disposed on the layer of flash material. An adhesive layer (18) formed of a second polymer material has a first surface that is attached to a second side of the film substrate.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 1, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 1, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 1, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.