Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods
CA 2353994 A1 · Owner: Keogh, Raymond S. · Inventors: Keogh, Raymond S.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An apparatus and method of forming filament circuit patterns with planar and non-planar portions and interconnection cards smart cards or optical fiber , circuit cards formed therefrom are provided. A filament circuit path is scribed by moving a filament guide and a substrate relative to one another and dispensing a filament on, or in the vicinity of a surface of the , substrate. The filament or the substrate or both have adhesive surface(s). The adhesive surface is capable of being adhesively actuated by application of energy. Energy is applied simultaneous with or subsequent to, scribing. A , portion of the filament circuit pattern is planar and another portion is nonplanar. The …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 7, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 7, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 7, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
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Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.