Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpieces
CA 2352160 A1 · Owner: Nuch, Voha · Inventors: Wang, Hui; Nuch, Voha; Gutman, Felix
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A wafer chuck assembly for holding a wafer during electroplating and/or electropolishing of the wafer includes a wafer chuck for receiving the wafer. The wafer chuck assembly also includes an actuator assembly for moving the wafer chuck between a first and a second position. When in the first position the wafer chuck is opened. When in the second position the wafer chuck is , closed.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 24, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 24, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 24, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.