Heat sink including heat receiving surface with protruding portion
CA 2349833 A1 · Owner: Sony Computer Entertainment Inc. · Inventors: Ootori, Yasuhiro; Sasaki, Chiyoshi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A heat sink includes a heat receiving surface having a plurality of protruding portions, the heat receiving surface of which is thermally connected to a heat generating component through a heat transfer rubber to receive heat from the , heat generating component and then dissipate the heat.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 6, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended September 6, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 6, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.