Fabrication process for flex circuit applications
CA 2344826 A1 · Owner: Ballard, William V. · Inventors: Harvey, Paul M.; Ballard, William V.; Dower, William V.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention provides a process for fabricating a flexible printed circuit with at least one etched or plated feature on each major surface of said flexible circuit, comprising the steps of providing an input material (1) with two major surfaces, including a dielectric substrate (10) and at least one conductive base layer (11), laminating a photoresist (16) with a cover sheet (14) onto at least one major surface of the input material (1) and printing , an image (18) onto the cover sheet (14) or removing the cover sheet (14) and printing the image (18) onto the photoresist (16) directly.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 11, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended February 11, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 11, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.