Polishing pads for a semiconductor substrate
CA 2337202 A1 · Owner: Anjur, Sriram P. · Inventors: Kaufman, Frank B.; Anjur, Sriram P.; Sevilla, Roland K.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A polishing pad for polishing a semiconductor wafer which includes an opencelled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pores of the porous substrate have an average pore diameter of from about 5 to about 100 microns which enhances pad polishing performance.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 8, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 8, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 8, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.