Multiple blank for electronic components, in particular surface acoustic wave components, and method of building up bumps, solder frames, spacers and the like on the multiple blank
CA 2332891 A1 · Owner: Wossler, Manfred · Inventors: Weidner, Karl; Wossler, Manfred; Kruger, Hans
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention relates to a multiple printed panel (1) which can be divided into individual printed panels (2) for electronic components (3) especially , acoustic surface wave components. Each of these electronic components is suitable for contacting chips on the individual printed panels (2) using the flip-chip technique and for contacting the individual printed panels (2) with external connections using SMD technology. The inventive multiple printed panel (1) has metal-plated surfaces (5) for each individual printed panel (2) said metal-plated surfaces being located on a network which is integrated in the multiple printed panel and leads to a terminal pole (8). The bumps (13) are …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 3, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended May 3, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 3, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.