Process for coating substrates with metals
CA 2331757 A1 · Owner: Steinius, Ortrud · Inventors: Fix, Sabine; Steinius, Ortrud; Hupe, Jurgen
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention relates to a method for metal coating of substrates with polymer surfaces in the production of printed boards more particularly, printed , boards with micro-orifices and fine structures by applying an electrically , conductive polymer layer and subsequently conducting metalization. The electrically conductive polymer layer is doped with a colloidal palladium solution containing tin before the metalization step is carried out whereby , the electrically conductive polymer is poly-3,4-ethylene-dioxythiophene and is brought into contact with a copper(II) salt solution before metalization.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed May 14, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended May 14, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 14, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.