Encapsulation process for microelectromechanical structures
CA 2325097 A1 · Owner: Jds Uniphase Corporation · Inventors: Wood, Robert L.; Dudley, Bruce W.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method of encapsulating microelectromechanical (MEMS) structures is provided wherein the MEMS structures are formed on a substrate and encapsulated prior, to packaging thereof. A sacrificial material is first deposited over the substrate to cover, at least a portion of the MEMS structure. An encapsulation material is then deposited, over the sacrificial material such that the encapsulation material covers at least a portion, of the sacrificial material over the MEMS structure. The sacrificial material is, subsequently removed such that the encapsulation material forms a shell spaced apart, from and covering the MEMS structure and permits the intended operation of the MEMS, …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 3, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 3, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 3, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.