Solderless pin connection
CA 2302798 C · Owner: Cubon, Michael M. · Inventors: Cubon, Michael M.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A solderless pin connection for a printed circuit board wherein a substrate is printed with polymer thick film. The substrate includes an inner surface, defining a hole. The polymer thick film is applied along a top surface of the substrate, and along the inner surface. The polymer thick film may additionally be applied, along a bottom surface of the substrate with an additional layer along the inner, surface. A pin, having a diameter less than a diameter of the hole is press , fit within, the polymer thick film along the inner surface the pin. The pin is staked with respect, to the substrate using a mechanical connection such as barbs or a folded portion on, a staked end of the pin.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 28, 2000 and granted December 23, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 28, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 28, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.