Copper coatings to improve peel strength
CA 2298684 A1 · Owner: Holman, Eric L. · Inventors: Holman, Eric L.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method is disclosed for providing an improved adherence or peel strength, between copper foil and a circuit board laminate having low dielectric and high glass transition temperature, through the use of an intermediate organic resin compound. Epoxy and phenoxy resins having average molecular weight in excess of 4500 are preferred to achieve necessary increases in peel strength for low dielectric circuit board laminate materials.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 29, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended April 29, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 29, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.