Semiconductor chip packaging and method for the production thereof
CA 2296333 A1 · Owner: Martinelli, Marco · Inventors: Martinelli, Marco; Schmidt, Walter
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention relates to a method for producing semiconductor chip packaging using semiconductor chips (1). At least one semiconductor chip (1) is provided with at least one dielectric film (2, 2' 22). At least one opening is made in , the at least one film (2 2', 22). Current paths (40, 42, 30000, 30002) are placed on the at least one film (2, 2' 22) and in the at least one opening in such a way that at least one semiconductor chip connection (1.2) comes into electrical contact with the current paths (40 42, 3000, 3002) by means of at , least one opening.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 23, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 23, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 23, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.