Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line (s)
CA 2295421 A1 · Owner: Besi Singulation B.V. · Inventors: Van Sprang, Wilhelmus Gijsbertus Leonardus; Rischke, Jorg Werner; Menschaar, Hugo Franklin
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The invention relates to a method and a device for separating products mounted on a common substrate from each other, along, (a) cutting line(s). The products each comprise one or more chips present on said substrate and connecting means connected thereto the connecting, ends remote from the chip of which are provided with solder balls bonded thereto. The products are clamped down on a supporting element by using a sub-atmospheric pressure, and the supporting element and a rotary cutting blade are moved relative to each other along the intended cutting line so as to cut through the substrate. A liquid is supplied at the location of said cutting line on either side of the substrate.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 14, 2000. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended January 14, 2020.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 14, 2022.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.