Solventless forming method for heat exchanger panels
CA 2294866 A1 · Owner: Doshi, Shailesh · Inventors: Doshi, Shailesh; Farkas, Nicholas Akos; Stevens, Kenneth Earl
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for forming thermoplastic heat exchanger panels without using solvents, wherein a co-extruded film is used to provide a layer of toughened heat-sealable nylon on a layer of regular nylon and using such panels in a , gas-assisted press bonding process to form the heat exchanger panels.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 5, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 5, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 5, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.