Flip-chip package with optimized encapsulant adhesion and method
CA 2291568 A1 · Owner: Matienzo, Luis J. · Inventors: Kodnani, Ramesh R.; Tran, Son K.; Matienzo, Luis J.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An electronic module having enhanced adhesion at the chip passivation and underfill interface, is disclosed. The surface of the chip passivation is chemically modified to a sufficient depth such, that the cured passivation is more reactive. The modified surface is treated with a polyamine, preferably having a cyclic amine group extending from a preferably aliphatic backbone. During, reflow of the solder joints of the electronic module by heating the modified , passivation reacts with the polyamine at the amine functionality. Following underfill of the electronic module with a, polymeric material preferably an epoxy resin, the polyamine on the surface of the passivation reacts, with …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 2, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 2, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 2, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.