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Canadian application, no grantCanada

Substrate for electronic packaging, pin jig fixture

CA 2290819 A1 · Owner: Neftin, Shimon · Inventors: Neftin, Shimon; Mirsky, Uri

CIPO record

Overview

Drawings and full text

Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

A substrate (1, 16, 21, 31) for electronic packaging the substrate having a , discrete, generally prismatoid initially electrically conductive valve metal solid body with one or more spaced apart original valve metal filled vias (6, 19 28, 32) each individually electrically isolated by a porous oxidized body portion therearound. A pin jig fixture (41) for mechanically masking a metal surface, the pin jig fixture (41) having an anodization resistant bed of pins (42) each pin (43) having a leading end surface (44) for intimate juxtaposition against a metal surface to masks portions thereof.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed May 20, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended May 20, 2018.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 20, 2020.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledMay 20, 1998
GrantedNo grant recorded
Term endedMay 20, 2018
Patent numberCA 2290819 A1
Classification (IPC)H01L23/52 +2 more

Timeline

Timeline From CIPO dates

1999200120032005200720092011201320152017Application filedMay 20, 1998Term endedMay 20, 2018

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.