Integrated circuit package and method of making
CA 2290587 A1 · Owner: Panczak, Anthony E. · Inventors: Glenn, Thomas P.; Panczak, Anthony E.; Hollaway, Roy D.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package for an integrated circuit is described as are methods of making the , package (10). The package includes a substrate (200) having a generally planar first surface (201) on which a metal die pad is formed. An integrated circuit die (100) is attached to the metal die pad. An adhesive bead (300) surrounds the integrated circuit die and covers the exposed periphery of the metal die pad. A generally planar lid (401) is in a press-fitted interconnection with the bead. An adhesive material covers conductive structures on the die such , as bonding pads, to prevent corrosion. Optionally the package has vertical , peripheral sides. The methods of making the package include methods for …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 11, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 11, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 11, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.