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Canadian application, no grantCanada

Adhesive, method for bonding, and assemblies of mounted boards

CA 2289733 A1 · Owner: Date, Hiroaki · Inventors: Imaizumi, Nobuhiro; Date, Hiroaki; Tokuhira, Hideshi

CIPO record

Overview

Drawings and full text

Its claims, description and drawings are in the Canadian Patents Database.

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Abstract From the Canadian patent

A two-part adhesive, characterized by being essentially composed of an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and being separated into agent (A) containing one or two components selected from among an acrylic monomer a peroxide and a reducing agent and , agent (B) containing the other components that have not been selected for agent (A). This adhesive can constantly give a highly reliable bonding which is free from heat stress and excellent in heat resistance.

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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.

Why it's free to use

  • Filed May 11, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended May 11, 2018.
  • A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by May 11, 2020.
  • We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
FiledMay 11, 1998
GrantedNo grant recorded
Term endedMay 11, 2018
Patent numberCA 2289733 A1
Classification (IPC)C09J163/00 +2 more

Timeline

Timeline From CIPO dates

1999200120032005200720092011201320152017Application filedMay 11, 1998Term endedMay 11, 2018

Sources & verification

Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.