Method of reducing sputtering burn-in time, minimizing sputtered particulate, and target assembly therefor

Abstract From the Canadian patent

A target (1) for sputtering is subjected to a surface treatment process and special packaging after target (1) manufacture for improved sputtering performance and process and yield by reducing particulates. The sputtering target (1) is first surface treated to remove oxides impurities and , contaminants. The surface treated target (1) is then covered with a metallic enclosure (5) and optionally, a passivating barrier layer. The metallic enclosure (5) protects the target surface from direct contact with subsequently employed packaging material such as plastic bags (23) thereby , eliminating source of organic materials during sputtering operations. The surface treatment of the target …