Surface treatment of copper to prevent microcracking in flexible circuits
CA 2287707 C · Owner: Gould Electronics Inc. · Inventors: Merchant, Harish D.; Lee, Chin-Ho; Poutasse, Charles A.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
In one embodiment, the present invention relates to a flexible laminate comprising a first flexible polymeric film; a copper layer having a microcracking, prevention layer on at least one side the microcracking prevention layer sufficient to, prevent microcracks in a copper layer having a thickness of up to about 18 µm, during at least 50,000,000 bending cycles and/or a copper layer having a thickness, of up to about 35 µm during at least 20,000,000 bending cycles of the flexible, laminate; and a second flexible polymeric film.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 26, 1999 and granted July 8, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 26, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 26, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.