Board to board interconnect

Abstract From the Canadian patent

A board-to-board interconnect socket provides electrical interconnection between printed circuit boards. Resilient metalized particle interconnects are disposed in holes in a rigid substrate of desired thickness. Each resilient interconnect includes first and second cap members that extend from opposing ends of the hole and beyond the respective surfaces of the substrate. The first and second cap members may be connected with a stem member or conductive paste that is disposed inside the hole. The hole may be lined with conductive material such as conductive plating to facilitate conduction of electricity.