High density connector and method of manufacture
CA 2267293 C · Owner: Houtz, Timothy W. · Inventors: Lemke, Timothy A.; Houtz, Timothy W.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Electrical connectors capable of being mounted on circuit substrates (204) by BGA techniques are disclosed. Also disclosed is a method for manufacturing such connectors. There is at least one recess (20 22, 24) on the exterior side of the connector elements (12). A conductive contact (66) extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element in the form of solder balls (82) is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portion of the contact extending into said recess. Contacts are secured in …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 10, 1997 and granted December 17, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 10, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 10, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.