Ic module, method of manufacturing the same, and ic card including ic module
CA 2265918 A1 · Owner: Horio, Tomoharu · Inventors: Hirai, Minoru; Horio, Tomoharu; Ueda, Shigeyuki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for fabricating an IC module (1) including a resin packaging step conducted by using top and bottom forces (5) defining a cavity (50) in a clamped state, wherein the packaging step comprises placing a substrate (2) on which an IC chip (3) is mounted and a winding coil (20A) having a doughnutlike planar shape and a flat overall shape in a cavity (50) and injecting a molten resin into the cavity (50). When resin packaging is conducted on a substrate (2) on which an antenna coil (20) is patterned spacers (28) having , a height equal to or substantially equal to that of the cavity (50) are provided on the substrate (2), which is then placed in the cavity (50) and packaged by …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed July 13, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended July 13, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by July 13, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.