Solder placement apparatus and method
CA 2260342 C · Owner: Cherbettchian, Agop H. · Inventors: Cherbettchian, Agop H.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A solder placement device (10) forms a selected length of a solder wire (14) to be used in mounting an optical fiber (20) to a substrate 116 so that the optical fiber (2)) and a laser diode (22) may be optically coupled together. The solder placement device (10) includes casing (16) that contains a plunger (24) arranged for reciprocal movement along an axis in the casing (16). A solder input tube (30) guides solder (14) from a supply spool (12) to a leaf spring retainer (42) inside the casing (16). The leaf spring retainer (42) is mounted to the plunger (24) and arranged to allow unidirectional movement of the solder wire (14) along the axis such that movement of the plunger (24) toward the …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 25, 1999 and granted December 16, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended January 25, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 25, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.