Apparatus and method for non-destructive, low stress removal of soldered electronic components
CA 2259043 A1 · Owner: Ibm Canada Limited-Ibm Canada Limitee · Inventors: Racicot, Mario; Bergeron, Christian; Lord, Raymond
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Circuit chips, such as known good die (KGD) chips are removed from an , assembly including a plurality of circuit chips attached to at least one chip carrier or , substrate. The substrate is held, within a top plate with the circuit chips positioned within successive chip cavities within a bottom, plate. Each chip cavity includes a load surface separated by a cascade effect pitch with respect to, adjacent chip cavities. A cascade effect shear force is sequentially applied to the circuit chips to, remove them from the substrate. The chips may be heated to a temperature facilitating shear within, a temperature range at which solder connections are solid and the chips , further heated …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed January 18, 1999. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended January 18, 2019.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by January 18, 2021.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.