Package for semiconductor power device and method for assembling the same
CA 2255441 C · Owner: Kijima, Kenji · Inventors: Shimizu, Toshio; Kijima, Kenji; Sekiya, Hiroki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A package for a semiconductor power device which comprises: a conductive bottom plate as a heat sink; an insulating substrate mounted on the bottom plate; a copper film formed on the insulating substrate to expose a peripheral region of the insulating substrate; semiconductor chips disposed on the copper film; a container arranged on the bottom plate surrounding the insulating substrate; an external terminal supported through the container and connected electrically with the semiconductor chips; and a silicone gel filled within the container wherein a solidified, insulating material is disposed on an outer edge region of the copper film and the peripheral region of the insulating substrate. …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 7, 1998 and granted August 5, 2003. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended December 7, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 7, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.