Plated non-conductive products and plating method for the same
CA 2254834 A1 · Owner: Kanto Kasei Co. Ltd. · Inventors: Iizawa, Tsutomu; Ishida, Takuya; Murayama, Tamotsu
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Object, A method of forming a plate layer with extremely high adhesiveness on a surface of a non-conductive product. Solution A method of plating a non-conductive product comprising the steps of:, forming a coating film on necessary portions of a surface of the non-conductive product with a conductive paint having the following composition of solid ingredients: (A) resin vehicles 20 to 80 weight %, (B) conductive whisker 80 to 20 weight % and, executing electroless plating on a surface of the coating film, or a method for improving adhesiveness of a plate layer by forming , when forming a coating film microvoids in a surface of the coating film.
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed November 26, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended November 26, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by November 26, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.