Method for creating via hole in chip
CA 2250795 C · Owner: Cheng, Shiang Ching · Inventors: Chou, Chin-Yi; Mou, Tse-Chi; Yang, Arnold Chang-Mou
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A method for creating via holes in a chip or a plurality of chips of a wafer is disclosed. The method is performed by using a pre-patterned transparent mask on the back of the chip and bombarding the chip(s), through the positioning holes of the transparent mask corresponding to the pre-formed pattern with accelerated particles. According to this method via holes can be created from the back of the chip(s) without interfering with the existent IC structure of the chip(s). The present method is highly efficient because a number of via holes can be formed simultaneously by using a large pre-patterned mask to cover the entire wafer. In addition the, present method is cost-effective because no …
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed October 21, 1998 and granted October 8, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended October 21, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by October 21, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.