Composition and method for stripping solder and tin from printed circuit boards
CA 2248497 C · Owner: Fakler, John T. · Inventors: Johnson, Todd Ii; Fakler, John T.
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin a source of, ferric ions in an amount sufficient to dissolve the tin-copper alloy and a source of halide ions, in an amount sufficient to significantly improve the resistance between printed circuits.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed September 28, 1998 and granted February 26, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended September 28, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by September 28, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.