Process for delaminating organic resin from board and process for manufacturing organic resin multi-layer wiring board
CA 2245047 A1 · Owner: Tanaka, Shinji · Inventors: Tanaka, Shinji; Tamura, Koetsu; Ishida, Hisashi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A process for delaminating an organic resin insulation layer and a board therefor without adversely affecting the organic resin multi-layer wiring layer. A polyimide insulation layer is formed on a quartz glass board. Another polyimide insulationlayer and a wiring layer which together with the polyimide insulation layer form a first block, are laminated on the polyimide insulation layer. The back of the quartz glass board is irradiated with an excimer laser to delaminate the first block and the quartz glass board. Ultraviolet rays from the excimer laser react with the polyimide insulation layer in a photochemical reaction which removes the polyimide insulation layer located at the interface …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed December 15, 1994. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended December 15, 2014.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by December 15, 2016.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.