Cooling structure of multichip module and method of manufacturing it

Abstract From the Canadian patent

A cooling structure is provided for a multichip module on which integrated circuit devices (i.e. LSI devices) having heat-radiation surfaces are mounted, wherein there are provided a heat sink thermal conduction, blocks and thermal compounds. Recess portions are formed at a surface of the heat sink in connection with the integrated circuit devices of the multichip module. Low melting point metal material such as solder is supplied to interiors of the recess portions of the heat sink. The thermal conduction blocks are partially inserted into the interiors of the recess portions under the condition where the low melting point metal material is heated and melted, so that the thermal conduction …