Semiconductor device with an improved lead-chip adhesion structure and lead frame to be used therefor
CA 2240589 C · Owner: Ichinose, Michihiko · Inventors: Ichinose, Michihiko
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
There is provided an adhering structure between a semiconductor chip and two alignments of first side inner leads and second side inner leads extending in first and second sides of the semiconductor chip respectively. Each of the first and second side inner leads has a stitched portion. The first and second sides are separated by a center line of the semiconductor chip. The semiconductor chip and the first and second side inner leads are adhered to each other by first and second side electrically insulative adhesive tapes respectively. Each of the first and second side electrically insulative adhesive tapes has both surfaces with adhesion force. The first and second side electrically …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 12, 1998 and granted February 5, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 12, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 12, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.