Method and apparatus for attaching electronic components to substrates
CA 2240184 A1 · Owner: Meyer, Bernad Allen · Inventors: Baker, Jay Deavis; Kneisel, Lawrence Leroy; Achari, Achyuta
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
There is disclosed herein a method for attaching an electronic component having at least one termination to a substrate having a respective mounting pad for each termination. One approach to this method comprises: providing the electronic component and substrate placing, the electronic component on the substrate such that each component termination rests atop its respective mounting pad, selectively preheating at least one selected mounting pad to a predetermined temperature without significantly raising the temperature of the substrate as a whole and, dispensing a predetermined amount of bonding compound onto each selected mounting pad immediately after the preheating step.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 10, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended June 10, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 10, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.