Epoxy resin composition and resin-encapsulated semiconductor device
CA 2233603 A1 · Owner: Sumitomo Chemical Co. Ltd. · Inventors: Hirano, Yasuhiro; Hayashi, Toshiaki
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1):, (see fig. I), wherein, R1 to R9 represent each independently a hydrogen atom, an acyclic or cyclic alkyl group having 1 to 6 carbon atoms, a substituted or unsubstituted phenyl group or a halogen atom, (B) a polyfunctional epoxy compound having a functional group number of two or more, and, (C) an epoxy curing agent containing a phenolic hydroxyl group, wherein the proportion of the epoxy compound (A) is from 1 to 99% by weight based on the total weight of the epoxy compounds (A) and (B). The epoxy resin composition has low moisture absorption and other properties in …
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Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 30, 1998. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended March 30, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 30, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.