Integrated circuit device cooling structure
CA 2233481 C · Owner: Umezawa, Kazuhiko · Inventors: Umezawa, Kazuhiko
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
An integrated circuit device cooling structure includes a wiring substrate, an integrated circuit device, a heat sink, and heat radiation vias. The integrated circuit device is mounted on the first surface side of the wiring substrate. The heat sink is fixed to the second surface of the wiring substrate and thermally coupled to the wiring substrate. The heat radiation vias are formed in the wiring substrate to transmit heat generated by the integrated circuit device to the heat sink.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed March 27, 1998 and granted January 15, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended March 27, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by March 27, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.