Cooling structure for multi-chip module
CA 2228486 C · Owner: Umezawa, Kazuhiko · Inventors: Umezawa, Kazuhiko
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A cooling structure for a multi-chip module includes a multi-chip module, a fan-builtin heat sink a, cooling fan, and openings. In the multi-chip module a, plurality of chips are mounted on a wiring board. The heat sink has a bottom plate and is arranged above the multi-chip module. The cooling fan is arranged in an upper portion of the heat sink to cool the multi-chip module. The openings are formed in a bottom plate of the heat sink to supply air from the cooling fan to the multi-chip module.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed February 2, 1998 and granted January 1, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended February 2, 2018.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by February 2, 2020.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.