Parts-packaging substrate and method for manufacturing same as well as method for manufacturing a module
CA 2224188 A1 · Owner: Kumagai, Koichi · Inventors: Edahiro, Teruki; Wada, Yoshinori; Kumagai, Koichi
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
A masking film (3) having desired apertures (2) is applied to a metal wiring board (1). With this construction, a conventional insulation substrate which is to be a thick base and a conventional resist layer can be eliminated. Further, when the terminal parts (T) of the metal wiring board (1) are bent connection terminals which are substituted for connector terminals for the connection to another board are formed integrally to eliminate the connector terminals. Thus, a low cost component mounting board is provided.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed April 7, 1997. No grant is recorded for it in Canada; had it been granted, its 20-year term would have ended April 7, 2017.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by April 7, 2019.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.