Process for assembling electronics using microwave irradiation
CA 2222703 C · Owner: Garard, Richard S. · Inventors: Wei, Jianghua; Garard, Richard S.; Fathi, Zakaryae
Overview
Its claims, description and drawings are in the Canadian Patents Database.
Open the CIPO recordAbstract From the Canadian patent
The present invention provides a process for assembling electronics which allows for rapid heating and fast curing and avoids subjecting the components , to potentially damaging cure conditions. The process includes applying conductive or non-conductive curable thermoplastic or thermosetting resins having adhesive properties, to a surface of the substrate or electrical component or both. One or more electrical components may be mounted on the substrate using the adhesive properties of the resin. The resin is then subjected to variable frequency microwave irradiation selected to cure the resin without adversely affecting the substrate or electrical components.
Read the whole patent
Listed from its CIPO record in Patent Yard's archive of Canadian patents past their term. Its claims, description and drawings are in the CIPO record and on Google Patents, and the Claude kit works from them.
Why it's free to use
- Filed June 27, 1996 and granted February 12, 2002. A Canadian patent filed from October 1, 1989 lasts 20 years from filing, so its term ended June 27, 2016.
- A certificate of supplementary protection adds at most two years for a drug, so even that would have ended by June 27, 2018.
- We check Canadian rights only. A patent in its family in another country could still be in force: check its family on Google Patents.
Timeline
Timeline From CIPO dates
Sources & verification
Official CIPO records
Everything on this page comes from the CIPO record linked above. Contains information licensed under the Open Government Licence – Canada.